Moly Tooj

Taw qhia rau Molybdenum Copper thiab Copper Clad Molybdenum

Molybdenum tooj liab

Molybdenum tooj liab (MoCu) yog cov khoom siv sib xyaw uas muaj cov thermal conduction ntawm tooj liab thiab qis thermal expansion ntawm molybdenum. Ntawm peb qhov chaw tsim khoom, peb muab ntau yam khoom siv molybdenum tooj liab, nrog rau cov phaj, nplooj ntawv, ntawv ci, rods, thiab machined qhov chaw, nrog rau feem ntau piv ntawm 70/30 thiab 8{{ 16}/20. Tsis tas li ntawd, peb muab qhov piv ntawm Mo thiab Cu ntawm 50/50, 60/40, thiab 85/15. Peb cov ntawv molybdenum tooj liab thiab cov ntawv ci muaj qhov tuab ntawm 3 "mus rau tsawg dua 0.002", thaum peb cov pas nrig thiab cov xov hlau muaj cov kab uas hla ntawm 0.01 "mus rau 10.0" lossis ntau dua.

Lub thermal conductivity ntawm molybdenum tooj liab nyob ntawm {{{0}}} W/m·K, thaum cov hluav taws xob conductivity nyob ntawm 38-66 IACS feem pua ​​Min. Cov coefficient ntawm thermal expansion (CTE) nyob ntawm 6. MoCu qhov ua tau zoo thermal conductivity thiab haum coefficient ntawm thermal expansion (CTE) phim cov khoom siv hluav taws xob. Ntxiv mus, molybdenum tooj liab muaj zoo heev hermeticity thiab machinability, ua rau nws yog ib tug zoo heev cov ntaub ntawv rau tshav kub dab dej, tshav kub kis, thiab lwm yam baseplates siv nyob rau hauv IGBT, LDMOS, thiab GaN / GaAs-raws li li.

Xaiv cov khoom ntawm cov dab dej kub thiab cov khoom siv hluav taws xob rau cov khoom siv hluav taws xob ntau zaus thiab cov khoom siv hluav taws xob siab yuav tsum tau ua kom zoo CTEs, thiab cov ntaub ntawv molybdenum tooj liab muaj CTEs uas muaj li ntawm 5.6x 10-6/K txog 11.5 × 10-6 K . Qhov no suav nrog CTEs ntau yam, 3 × 10-6 / K txog 10 × 10-6 / K, ntawm cov khoom ntim khoom siv hluav taws xob thiab cov khoom siv ceramic, suav nrog Si, GaN, thiab GaAs. Tsis tas li ntawd, CTE ntawm molybdenum tooj liab composites tuaj yeem phim CTE ntawm Al2O3, BeO, AlN, thiab SiC. Kev sib xyaw ua ke ntawm CTEs zoo tuaj yeem ua tiav qhov txo qis ntawm thermal stresses uas txhim kho kev ua haujlwm kev ntseeg siab thiab kev ua neej nyob ntawm cov khoom siv hluav taws xob.

Molybdenum tooj liab muaj qhov zoo tshaj plaws thermal kis tau zoo, uas yog qhov tseem ceeb rau cov dab dej kub thiab cov khoom siv hluav taws xob hauv cov hluav taws xob muaj zog thiab cov khoom siv hluav taws xob siab. Piv txwv li, MoCu composites uas muaj 15 feem pua ​​​​rau 18 feem pua ​​​​tooj liab, xws li Mo75Cu25, nthuav qhia tshwj xeeb thermal conduction siab txog 160 W·m-1 ·K-1. Piv txwv li, tooj liab tungsten composite cov ntaub ntawv muaj cov thermal thiab high hluav taws xob conductivity, tab sis molybdenum tooj liab muaj qhov tsawg dua qhov ceev thiab superior machinability. Ob qhov zoo no yog cov kev txhawj xeeb tseem ceeb rau qhov hnyav-sensitive thiab kev sib xyaw micro-electronics.

Tsis tas li ntawd, molybdenum tooj liab muaj lwm yam khoom zoo nkauj, xws li tus nqi tawm ntawm tsawg dua 5.0 x 10-9 Pa.m3/s, ua rau nws haum rau qhov chaw nqus tsev. Kev tshem tawm cov impurities kuj tseem yooj yim, suav nrog Mo thiab Cu oxides thiab lwm yam impurities xws li N₂, H₂, thiab C.

Hauv cov ntsiab lus, molybdenum tooj liab yog cov khoom siv zoo tshaj plaws rau cov dab dej kub thiab cov khoom siv hluav taws xob vim nws qhov zoo tshaj plaws cua sov dissipation, hluav taws xob kis tau tus mob, hnyav rhiab heev, thiab machinability. Peb lub tuam txhab yog ib qho ntawm cov khoom siv molybdenum tooj liab, thiab peb txaus siab rau peb tus kheej ntawm peb lub peev xwm muab peb cov neeg siv khoom zoo molybdenum tooj liab cov ntaub ntawv uas ua tau raws li lawv cov kev cai tshwj xeeb. Tiv tauj peb hnub no kom paub ntau ntxiv txog peb cov khoom thiab.

Copper Clad Molybdenum

Copper Clad Molybdenum, tseem hu ua MoCu Laminates, yog cov qauv uas muaj ntau yam Mo / MoCu thiab Cu ua ke. Lawv tau dav siv nyob rau hauv high-frequency thiab high-power daim ntaub ntawv, ua tsaug rau lawv superior thermal zog. Hauv tsab xov xwm no, peb yuav tham txog cov qauv sib txawv ntawm MoCu Laminates thiab lawv cov khoom.

MoCu Laminates muaj nyob rau hauv peb yam qauv - CMC (Cu/Mo/Cu), CPC (Cu/MoCu/Cu), thiab SCMC (Cu/Mo/Cu/Mo/Cu).

CMC yog peb txheej molybdenum tooj liab laminate uas muaj ob txheej tooj liab txheej thiab ib txheej molybdenum core. Cov txheej txheem peb txheej no muaj nyob rau hauv cov txheej txheem sib txawv, suav nrog 1: 1: 1, 1: 2: 1, 1: 3: 1, thiab 1: 4: 1. CMC muaj qhov ceev ntawm 9.3 txog 9.88 g / cm³ thiab thermal conductivity ntau ntawm 170-300 W / m·K. Nws cov hluav taws xob conductivity yog 101.3 IACS feem pua ​​​​Min, thiab CTE ntau yog 5.6-12.8 10-6/K.

CPC yog tooj liab-molybdenum tooj liab-tooj ​​liab laminated qauv. Cov txheej txheem molybdenum tseem ceeb ntawm CPC yog hloov kho los ntawm high-purity molybdenum mus rau molybdenum tooj liab uas muaj 15 feem pua ​​​​rau 40 feem pua ​​​​Wt tooj liab. Cov qauv CPC feem ntau yog CPC 141, uas muaj Mo70Cu30 core txheej thiab 1: 4: 1 thickness piv. CPC muaj qhov ceev ntawm 9.1 txog 9.54 g / cm³, thiab nws cov thermal conductivity ntau yog 220-255 W/m·K. Nws cov hluav taws xob conductivity yog 101.3 IACS feem pua ​​​​Min, thiab CTE ntau yog 8.4-11.5 10-6/K.

SCMC yog tsib-txheej molybdenum thiab tooj liab laminate, muaj ob txheej molybdenum core thiab peb txheej tooj liab. SCMC muaj qhov ceev ntawm 9.1 txog 9.4 g / cm³ thiab thermal conductivity ntau ntawm 190-220 W/m·K. Nws cov hluav taws xob conductivity yog 101.3 IACS feem pua ​​​​Min, thiab CTE ntau yog 7.2-8.5 10-6/K.

Copper Clad Molybdenum yog cov txheej txheem ntau txheej ua los ntawm symmetrically yob-bonding ntau txheej ntawm Mo / MoCu thiab Cu cov ntaub ntawv rau cov thickness ratios. Cov khaubncaws sab nraud povtseg yuav tsum tsis txhob sib txawv ntawm qhov tuab ntawm ntau tshaj 10 feem pua ​​​​ntawm cov kev qhia tshwj xeeb. Txhua qhov sib cuam tshuam ntawm molybdenum tooj liab laminates yuav tsum yog qhov tseeb thiab tiaj tus li sai tau kom tshem tawm cov kev tawg lossis tawg. Cov txheej txheej tooj liab muaj cov thermal conductivity siab thiab cov khoom siv hluav taws xob sib kis tau zoo, thaum lub molybdenum txheej ntxig ntawm cov txheej tooj liab tuav tag nrho cov coefficient ntawm thermal expansion ntawm laminate nyob rau hauv ib qho kev tsim nyog rau daim ntawv thov.

Copper Clad Molybdenum yog dav siv nyob rau hauv high-frequency thiab high-power daim ntaub ntawv vim nws zoo heev thermal conductivity thiab coefficient ntawm thermal expansion txuam. Qee qhov kev siv feem ntau ntawm MoCu Laminates suav nrog cov nqa khoom siv microwave, cov dab dej kub, cov khoom siv rau cov khoom siv semiconductor, cov khoos phis tawj siab ceev, thiab kev lag luam aerospace.

Hauv kev xaus, Copper Clad Molybdenum los yog MoCu Laminates yog ntau txheej txheej txheej uas muaj qhov sib txawv Mo / MoCu thiab Cu ua ke. Lawv muaj nyob rau hauv peb tus qauv, suav nrog CMC, CPC thiab SCMC. Cov laminates no muaj cov thermal conductivity thiab hluav taws xob zoo, tsis tshua muaj thermal expansion coefficient, siab kub lub zog, thiab zoo txhua yam khoom, uas ua rau lawv zoo tagnrho rau ntau yam kev ua haujlwm siab.

Cim npe nrov: moly copper, Tuam Tshoj, lwm tus neeg, yuav, muag, ua nyob rau hauv Suav teb